Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852965 | Semiconductor devices with through electrodes and methods of fabricating the same | Ho-Jin Lee, Byung-Lyul Park, Kwangjin Moon, Jin Ho An | 2017-12-26 |
| 9806004 | Semiconductor devices having a TSV, a front-side bumping pad, and a back-side bumping pad | Ho-Jin Lee, Byunglyul Park, Jinho An | 2017-10-31 |
| 9570377 | Semiconductor devices having through electrodes capped with self-aligned protection layers | Jeonggi Jin, Byung-Lyul Park, Sukchul Bang, Deokyoung Jung | 2017-02-14 |
| 9543200 | Methods for fabricating semiconductor devices having through electrodes | Kunsang Park, Sukyoung Kim, Ju-Il Choi, Byung-Lyul Park, Gilheyun Choi | 2017-01-10 |