Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806004 | Semiconductor devices having a TSV, a front-side bumping pad, and a back-side bumping pad | Ho-Jin Lee, Byunglyul Park, Jisoon Park | 2017-10-31 |
| 9799619 | Electronic device having a redistribution area | Jeonggi Jin, Kyu-Ha Lee, Jinho Chun, Byunglyul Park | 2017-10-24 |