JG

Jeffrey D. Gelorme

IBM: 4 patents #1,576 of 10,852Top 15%
Overall (2017): #45,499 of 506,227Top 9%
4
Patents 2017

Issued Patents 2017

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
9850406 Adhesive resins for wafer bonding Robert David Allen, Li-Wen Hung, Ratnam Sooriyakumaran, Linda Karin Sundberg 2017-12-26
9748131 Low temperature adhesive resins for wafer bonding Robert David Allen, Paul S. Andry, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang 2017-08-29
9627784 Method and apparatus for strain relieving surface mount attached connectors Michael A. Gaynes, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi, Marie-Claude Paquet +5 more 2017-04-18
9601364 Low temperature adhesive resins for wafer bonding Robert David Allen, Paul S. Andry, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang 2017-03-21