Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812425 | Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same | Bok Eng Cheah, Shanggar Periaman, Kooi Chi Ooi | 2017-11-07 |
| 9646953 | Integrated circuit packaging techniques and configurations for small form-factor or wearable devices | Bok Eng Cheah, Kooi Chi Ooi, Shanggar Periaman, Michael P. Skinner | 2017-05-09 |
| 9606949 | Universal scalable system: on-the-fly system performance conversion via PC-on-a-card and USB for smart devices and IoT enabling | Khang Choong Yong, Khai Ern See, Amit Kumar Srivastava, Teong Keat Beh, Eng Huat Goh | 2017-03-28 |
| 9596749 | Circuit board having a signal layer with signal traces and a reference plane with an additional signal trace larger than the signal traces | Kuan-Yu Chen, Yun Ling, Mohd Muhaiyiddin Bin Abdullah, Chung-Hao Chen, Hao-Han Hsu +1 more | 2017-03-14 |
| 9552995 | Electrical interconnect for an electronic package | Khang Choong Yong, Bok Eng Cheah, Teong Keat Beh, Howard L. Heck, Stephen H. Hall +1 more | 2017-01-24 |