| 9768223 |
Electronics device package and fabrication method thereof |
Yu-Ting Huang |
2017-09-19 |
| 9761555 |
Passive component structure and manufacturing method thereof |
Jiun-Yen LAI, Yu-Wen Hu, Bai-Yao Lou, Yen-Shih Ho, Hsin Kuan |
2017-09-12 |
| 9711469 |
Semiconductor structure having recess and manufacturing method thereof |
Geng-Peng PAN, Yi-Ming Chang |
2017-07-18 |
| 9685354 |
Separation apparatus and a method for separating a cap layer from a chip package by means of the separation apparatus |
Yen-Shih Ho, Tsang-Yu Liu, Yi-Ming Chang |
2017-06-20 |
| 9653500 |
Optical cover plate with improved solder mask dam on glass for image sensor package and fabrication method thereof |
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2017-05-16 |
| 9611143 |
Method for forming chip package |
Yen-Shih Ho, Tsang-Yu Liu, Yi-Ming Chang |
2017-04-04 |
| 9601460 |
Chip package including recess in side edge |
Yen-Shih Ho, Tsang-Yu Liu, Chia-Ming Cheng, Shu-Ming Chang, Tzu-Wen Tseng |
2017-03-21 |