| 9831184 |
Buried TSVs used for decaps |
— |
2017-11-28 |
| 9760132 |
Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad |
Leilei Zhang, Ron Boja, Zuhair Bokharey |
2017-09-12 |
| 9728481 |
System with a high power chip and a low power chip having low interconnect parasitics |
Joe Greco, Jun Zhai, Joseph Minacapelli, John Chen |
2017-08-08 |
| 9716051 |
Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity |
Leilei Zhang, Ron Boja, Zuhair Bokharey |
2017-07-25 |
| 9659815 |
System, method, and computer program product for a cavity package-on-package structure |
Ronilo Boja, Teckgyu Kang |
2017-05-23 |
| 9570284 |
Method and system for controlling a semiconductor fabrication process |
— |
2017-02-14 |