Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831189 | Integrated circuit package with a conductive grid formed in a packaging substrate | — | 2017-11-28 |
| 9760132 | Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad | Ron Boja, Abraham Yee, Zuhair Bokharey | 2017-09-12 |
| 9716051 | Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity | Ron Boja, Abraham Yee, Zuhair Bokharey | 2017-07-25 |