Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9760132 | Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad | Leilei Zhang, Ron Boja, Abraham Yee | 2017-09-12 |
| 9716051 | Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity | Leilei Zhang, Ron Boja, Abraham Yee | 2017-07-25 |