Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786517 | Ablation method and recipe for wafer level underfill material patterning and removal | Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui +2 more | 2017-10-10 |
| 9748199 | Thermal compression bonding process cooling manifold | Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, Shankar Devasenathipathy +1 more | 2017-08-29 |
| 9653411 | Electronic package that includes fine powder coating | Donglai Lu, Zhaozhi Li, Matthew T. Magnavita, Peng-Jen Chen | 2017-05-16 |