Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837367 | Fabrication of solder balls with injection molded solder | Takashi Hisada, Eiji Nakamura | 2017-12-05 |
| 9780442 | Wireless communication device with joined semiconductors | Noam Kaminski, Keishi Okamoto, Kazushige Toriyama | 2017-10-03 |
| 9586281 | Forming a solder joint between metal layers | Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama, Ting-Li Yang | 2017-03-07 |