Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698119 | Interfacial alloy layer for improving electromigration (EM) resistance in solder joints | Hirokazu Noma, Kazushige Toriyama | 2017-07-04 |
| 9586281 | Forming a solder joint between metal layers | Toyohiro Aoki, Akihiro Horibe, Hiroyuki Mori, Kazushige Toriyama, Ting-Li Yang | 2017-03-07 |