Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780442 | Wireless communication device with joined semiconductors | Toyohiro Aoki, Noam Kaminski, Keishi Okamoto | 2017-10-03 |
| 9772462 | Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide | Hirokazu Noma, Keishi Okamoto, Masao Tokunari, Yutaka Tsukada | 2017-09-26 |
| 9698119 | Interfacial alloy layer for improving electromigration (EM) resistance in solder joints | Hirokazu Noma, Yasumitsu Orii | 2017-07-04 |
| 9586281 | Forming a solder joint between metal layers | Toyohiro Aoki, Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Ting-Li Yang | 2017-03-07 |