TH

Takashi Hisada

IBM: 1 patents #5,570 of 10,852Top 55%
Overall (2017): #226,555 of 506,227Top 45%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9837367 Fabrication of solder balls with injection molded solder Toyohiro Aoki, Eiji Nakamura 2017-12-05