Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818724 | Interposer-chip-arrangement for dense packaging of chips | Jochen Kraft, Franz Schrank | 2017-11-14 |
| 9773729 | Method of producing a semiconductor device with through-substrate via covered by a solder ball | Cathal Cassidy, Franz Schrank | 2017-09-26 |
| 9768131 | Method of producing a semiconductor device with protruding contacts | Jochen Kraft, Karl Rohracher | 2017-09-19 |
| 9735101 | Semiconductor device with through-substrate via covered by a solder ball | Cathal Cassidy, Franz Schrank | 2017-08-15 |
| 9684074 | Optical sensor arrangement and method of producing an optical sensor arrangement | Franz Schrank, Eugene G. Dierschke | 2017-06-20 |
| 9577001 | Integrated imaging device for infrared radiation and method of production | Hubert Enichlmair, Rainer Minixhofer | 2017-02-21 |
| 9570390 | Semiconductor device with integrated hot plate and recessed substrate and method of production | Franz Schrank | 2017-02-14 |
| 9553039 | Semiconductor device with through-substrate via covered by a solder ball and related method of production | Cathal Cassidy, Franz Schrank | 2017-01-24 |
| 9543245 | Semiconductor sensor device and method of producing a semiconductor sensor device | Franz Schrank | 2017-01-10 |