Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818724 | Interposer-chip-arrangement for dense packaging of chips | Martin Schrems, Franz Schrank | 2017-11-14 |
| 9768131 | Method of producing a semiconductor device with protruding contacts | Karl Rohracher, Martin Schrems | 2017-09-19 |
| 9753218 | Semiconductor device with integrated mirror and method of producing a semiconductor device with integrated mirror | Joerg Siegert, Ewald Stueckler | 2017-09-05 |