Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818724 | Interposer-chip-arrangement for dense packaging of chips | Jochen Kraft, Martin Schrems | 2017-11-14 |
| 9773729 | Method of producing a semiconductor device with through-substrate via covered by a solder ball | Cathal Cassidy, Martin Schrems | 2017-09-26 |
| 9735101 | Semiconductor device with through-substrate via covered by a solder ball | Cathal Cassidy, Martin Schrems | 2017-08-15 |
| 9684074 | Optical sensor arrangement and method of producing an optical sensor arrangement | Eugene G. Dierschke, Martin Schrems | 2017-06-20 |
| 9608035 | Method of wafer-scale integration of semiconductor devices and semiconductor device | Cathal Cassidy, Joerg Siegert | 2017-03-28 |
| 9574723 | LED module, LED illumination means, and LED lamp for the energy-efficient reproduction of white light | Erwin Baumgartner | 2017-02-21 |
| 9570390 | Semiconductor device with integrated hot plate and recessed substrate and method of production | Martin Schrems | 2017-02-14 |
| 9553039 | Semiconductor device with through-substrate via covered by a solder ball and related method of production | Cathal Cassidy, Martin Schrems | 2017-01-24 |
| 9543245 | Semiconductor sensor device and method of producing a semiconductor sensor device | Martin Schrems | 2017-01-10 |