Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773729 | Method of producing a semiconductor device with through-substrate via covered by a solder ball | Martin Schrems, Franz Schrank | 2017-09-26 |
| 9735101 | Semiconductor device with through-substrate via covered by a solder ball | Martin Schrems, Franz Schrank | 2017-08-15 |
| 9633842 | Metal induced nanocrystallization of amorphous semiconductor quantum dots | Vidya Dhar Singh, Mukhles SOWWAN | 2017-04-25 |
| 9608035 | Method of wafer-scale integration of semiconductor devices and semiconductor device | Joerg Siegert, Franz Schrank | 2017-03-28 |
| 9553039 | Semiconductor device with through-substrate via covered by a solder ball and related method of production | Martin Schrems, Franz Schrank | 2017-01-24 |