Issued Patents 2016
Showing 51–54 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281266 | Stacked chip-on-board module with edge connector | Wael Zohni | 2016-03-08 |
| 9281271 | Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Frank Lambrecht | 2016-03-08 |
| 9269692 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2016-02-23 |
| 9241420 | In-package fly-by signaling | Richard Dewitt Crisp, Wael Zohni, Yong-Syuan Chen | 2016-01-19 |