Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9293445 | Wafer level packaging bond | Ping-Yin Liu, Li-Chen CHU, Hung-Hua Lin, H. T. Huang, Jung-Huei Peng +3 more | 2016-03-22 |
CL
Chia-Shiung Lan-Lin
Overall (2016): #164,698 of 481,213Top 35%
1
Patents 2016