Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349857 | Trench power MOSFET and manufacturing method thereof | — | 2016-05-24 |
| 9337049 | Manufacturing method of wafer level chip scale package structure | Chih-Cheng Hsieh | 2016-05-10 |
| 9299592 | Package structure and packaging method of wafer level chip scale package | Chih-Cheng Hsieh, Chun-Ying Yeh, Chung-Ming Leng | 2016-03-29 |