CL

Chung-Ming Leng

NC Niko Semiconductor Co.: 1 patents #3 of 4Top 75%
SC Super Group Semiconductor Co.: 1 patents #4 of 5Top 80%
📍 New Taipei, TW: #797 of 2,260 inventorsTop 40%
Overall (2016): #439,680 of 481,213Top 95%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9299592 Package structure and packaging method of wafer level chip scale package Chih-Cheng Hsieh, Hsiu-Wen Hsu, Chun-Ying Yeh 2016-03-29