Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490134 | Termination structure of semiconductor device and method for manufacturing the same | Yuan-Ming Lee | 2016-11-08 |
| 9299592 | Package structure and packaging method of wafer level chip scale package | Chih-Cheng Hsieh, Hsiu-Wen Hsu, Chung-Ming Leng | 2016-03-29 |