Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337049 | Manufacturing method of wafer level chip scale package structure | Hsiu-Wen Hsu | 2016-05-10 |
| 9299592 | Package structure and packaging method of wafer level chip scale package | Hsiu-Wen Hsu, Chun-Ying Yeh, Chung-Ming Leng | 2016-03-29 |