Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530714 | Low-profile chip package with modified heat spreader | Shantanu Kalchuri, Abraham Yee | 2016-12-27 |
| 9502355 | Bottom package having routing paths connected to top package and method of manufacturing the same | — | 2016-11-22 |
| 9478482 | Offset integrated circuit packaging interconnects | Zuhair Bokharey | 2016-10-25 |
| 9385098 | Variable-size solder bump structures for integrated circuit packaging | Zuhair Bokharey | 2016-07-05 |
| 9368183 | Method for forming an integrated circuit package | — | 2016-06-14 |
| 9368439 | Substrate build up layer to achieve both finer design rule and better package coplanarity | Zuhair Bokharey | 2016-06-14 |
| 9368422 | Absorbing excess under-fill flow with a solder trench | Ron Boja, Abraham Yee, Zuhair Bokharey | 2016-06-14 |