Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530714 | Low-profile chip package with modified heat spreader | Abraham Yee, Leilei Zhang | 2016-12-27 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530714 | Low-profile chip package with modified heat spreader | Abraham Yee, Leilei Zhang | 2016-12-27 |