Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530714 | Low-profile chip package with modified heat spreader | Shantanu Kalchuri, Leilei Zhang | 2016-12-27 |
| 9379202 | Decoupling capacitors for interposers | — | 2016-06-28 |
| 9368422 | Absorbing excess under-fill flow with a solder trench | Leilei Zhang, Ron Boja, Zuhair Bokharey | 2016-06-14 |