Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478482 | Offset integrated circuit packaging interconnects | Leilei Zhang | 2016-10-25 |
| 9385098 | Variable-size solder bump structures for integrated circuit packaging | Leilei Zhang | 2016-07-05 |
| 9368422 | Absorbing excess under-fill flow with a solder trench | Leilei Zhang, Ron Boja, Abraham Yee | 2016-06-14 |
| 9368439 | Substrate build up layer to achieve both finer design rule and better package coplanarity | Leilei Zhang | 2016-06-14 |