Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530717 | Bonded body and power module substrate | Nobuyuki Terasaki | 2016-12-27 |
| 9504144 | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste | Nobuyuki Terasaki, Kimihito Nishikawa, Yoshirou Kuromitsu | 2016-11-22 |
| 9480144 | Power module substrate, power module substrate with heat sink, and power module | Nobuyuki Terasaki, Yoshirou Kuromitsu | 2016-10-25 |
| 9426915 | Power module | Touyou Ohashi, Toshiyuki Nagase, Yoshirou Kuromitsu | 2016-08-23 |
| 9414512 | Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module | Kazuhiro Akiyama, Hiroshi Tonomura, Nobuyuki Terasaki, Yoshirou Kuromitsu | 2016-08-09 |
| 9401340 | Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device | Shuji Nishimoto, Toshiyuki Nagase | 2016-07-26 |
| 9355986 | Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer | Shuji Nishimoto, Kimihito Nishikawa | 2016-05-31 |
| 9237682 | Power module substrate with heat sink, and method for producing power module substrate with heat sink | Hiroya Ishizuka, Toshiyuki Nagase, Yoshirou Kuromitsu, Masakazu Edo, Hideyuki Miyake | 2016-01-12 |