Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9504144 | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste | Nobuyuki Terasaki, Yoshiyuki Nagatomo, Yoshirou Kuromitsu | 2016-11-22 |
| 9355986 | Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer | Shuji Nishimoto, Yoshiyuki Nagatomo | 2016-05-31 |