Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530717 | Bonded body and power module substrate | Yoshiyuki Nagatomo | 2016-12-27 |
| 9504144 | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste | Yoshiyuki Nagatomo, Kimihito Nishikawa, Yoshirou Kuromitsu | 2016-11-22 |
| 9480144 | Power module substrate, power module substrate with heat sink, and power module | Yoshiyuki Nagatomo, Yoshirou Kuromitsu | 2016-10-25 |
| 9414512 | Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module | Yoshiyuki Nagatomo, Kazuhiro Akiyama, Hiroshi Tonomura, Yoshirou Kuromitsu | 2016-08-09 |