Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9504144 | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste | Nobuyuki Terasaki, Yoshiyuki Nagatomo, Kimihito Nishikawa | 2016-11-22 |
| 9480144 | Power module substrate, power module substrate with heat sink, and power module | Yoshiyuki Nagatomo, Nobuyuki Terasaki | 2016-10-25 |
| 9426915 | Power module | Touyou Ohashi, Yoshiyuki Nagatomo, Toshiyuki Nagase | 2016-08-23 |
| 9414512 | Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module | Yoshiyuki Nagatomo, Kazuhiro Akiyama, Hiroshi Tonomura, Nobuyuki Terasaki | 2016-08-09 |
| 9237682 | Power module substrate with heat sink, and method for producing power module substrate with heat sink | Yoshiyuki Nagatomo, Hiroya Ishizuka, Toshiyuki Nagase, Masakazu Edo, Hideyuki Miyake | 2016-01-12 |