Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496146 | Method for forming through-base wafer vias | Changxue Wang, Daniel Kwo-Hung Shen | 2016-11-15 |
| 9487675 | Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivatives | Vijay Immanuel Raman, Christian Schade, Shyam Sundar Venkataraman, Eason Yu-Shen Su, Sheik Ansar Usman Ibrahim | 2016-11-08 |
| 9487674 | Chemical mechanical polishing (CMP) composition comprising a glycoside | Michael Lauter, Roland Lange | 2016-11-08 |
| 9458415 | Post chemical-mechanical-polishing (post-CMP) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acid | Shyam Sundar Venkataraman, Mingjie Zhong | 2016-10-04 |
| 9443739 | Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or Si1-xGex material in the presence of a CMP composition comprising a specific organic compound | Bastian Marten Noller, Bettina Drescher, Christophe Gillot | 2016-09-13 |
| 9416298 | Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactant | Bastian Marten Noller, Christophe Gillot, Diana Franz | 2016-08-16 |
| 9309448 | Abrasive articles, method for their preparation and method of their use | Christof Kujat, Kenneth Rushing | 2016-04-12 |
| 9263296 | Chemical mechanical polishing (CMP) composition comprising two types of corrosion inhibitors | Bastian Marten Noller, Michael Lauter, Albert Budiman Sugiharto, Kenneth Rushing, Diana Franz +1 more | 2016-02-16 |
| 9255214 | Chemical mechanical polishing (CMP) composition comprising inorganic particles and polymer particles | Michael Lauter, Vijay Immanuel Raman, Shyam Sundar Venkataraman, Daniel Kwo-Hung Shen | 2016-02-09 |