Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496146 | Method for forming through-base wafer vias | Yuzhuo Li, Daniel Kwo-Hung Shen | 2016-11-15 |
CW
Changxue Wang
Overall (2016): #435,309 of 481,213Top 95%
1
Patents 2016