Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9460980 | Systems, apparatus, and methods for heat dissipation | Sun Woong Yun, Houssam Jomaa, Joan Rey Villarba BUOT | 2016-10-04 |
| 9461008 | Solder on trace technology for interconnect attachment | Omar J. Bchir | 2016-10-04 |
| 9355898 | Package on package (PoP) integrated device comprising a plurality of solder resist layers | Houssam Jomaa, David Fraser Rae, Layal Rouhana, Omar J. Bchir | 2016-05-31 |