Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401287 | Methods for packaging integrated circuits | Loon Kwang Tan, Yuanlin Xie | 2016-07-26 |
| 9337240 | Integrated circuit package with a universal lead frame | Guan Khai Lee, Loon Kwang Tan, Pheak Ti Teh | 2016-05-10 |
| 9330997 | Heat spreading structures for integrated circuits | Ken Beng Lim, Myung June Lee, Yuan-Liang Li | 2016-05-03 |