Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478491 | Integrated circuit package substrate with openings surrounding a conductive via | Jianmin Zhang | 2016-10-25 |
| 9330997 | Heat spreading structures for integrated circuits | Ken Beng Lim, Yuan-Liang Li, Ping Chet Tan | 2016-05-03 |
| 9236341 | Through-silicon vias with metal system fill | Dong Woo Kim, Suresh Ramalingam | 2016-01-12 |