Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508563 | Methods for flip chip stacking | Woon-Seong Kwon | 2016-11-29 |
| 9418966 | Semiconductor assembly having bridge module for die-to-die interconnection | Woon-Seong Kwon | 2016-08-16 |
| 9245865 | Integrated circuit package with multi-trench structure on flipped substrate contacting underfill | Woon-Seong Kwon | 2016-01-26 |
| 9236341 | Through-silicon vias with metal system fill | Dong Woo Kim, Myung June Lee | 2016-01-12 |