Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508563 | Methods for flip chip stacking | Suresh Ramalingam | 2016-11-29 |
| 9418966 | Semiconductor assembly having bridge module for die-to-die interconnection | Suresh Ramalingam | 2016-08-16 |
| 9245865 | Integrated circuit package with multi-trench structure on flipped substrate contacting underfill | Suresh Ramalingam | 2016-01-26 |