Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9330997 | Heat spreading structures for integrated circuits | Ken Beng Lim, Myung June Lee, Ping Chet Tan | 2016-05-03 |
| 9312427 | Semiconductor structure and method for forming the same | Lei Guo | 2016-04-12 |
| 9230874 | Integrated circuit package with a heat conductor | — | 2016-01-05 |