Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425174 | Integrated circuit package with solderless interconnection structure | Tze Yang Hin, Chew Ching Lim | 2016-08-23 |
| 9401287 | Methods for packaging integrated circuits | Yuanlin Xie, Ping Chet Tan | 2016-07-26 |
| 9337240 | Integrated circuit package with a universal lead frame | Guan Khai Lee, Ping Chet Tan, Pheak Ti Teh | 2016-05-10 |