Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425174 | Integrated circuit package with solderless interconnection structure | Tze Yang Hin, Loon Kwang Tan | 2016-08-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425174 | Integrated circuit package with solderless interconnection structure | Tze Yang Hin, Loon Kwang Tan | 2016-08-23 |