Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337165 | Method for manufacturing a fan-out WLP with package | Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba +1 more | 2016-05-10 |
| 9318460 | Substrate and assembly thereof with dielectric removal for increased post height | Kazuo Sakuma, Belgacem Haba | 2016-04-19 |
| 9252122 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Wei-Shun Wang, Se Young Yang | 2016-02-02 |