Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9322901 | Multichip wafer level package (WLP) optical device | Nicole D. Kerness, Joy T. Jones, Christopher F. Edwards, Arkadii V. Samoilov, Phillip J. Benzel +1 more | 2016-04-26 |
| 9324687 | Wafer-level passive device integration | Amit S. Kelkar, Karthik Thambidurai, Viren Khandekar | 2016-04-26 |
| 9230903 | Multi-die, high current wafer level package | Arkadii V. Samoilov, Viren Khandekar, Pirooz Parvarandeh | 2016-01-05 |