Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496221 | Method for forming fuse pad and bond pad of integrated circuit | Tai-I Yang, Chih-Hao Lin, Hong-Seng Shue, Ruei-Hung Jang | 2016-11-15 |
MY
Marcus Yang
Overall (2016): #296,053 of 481,213Top 65%
1
Patents 2016