Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9500541 | Method and device for determining the pressure distribution for bonding | Bernhard Rebhan, Jurgen Burggraf | 2016-11-22 |
| 9478518 | Method for permanent connection of two metal surfaces | Viorel Dragoi | 2016-10-25 |
| 9358765 | Method for coating and bonding substrates | Bernhard Rebhan | 2016-06-07 |
| 9362154 | Method for treatment of a temporarily bonded product wafer | Jurgen Burggraf, Harald Wiesbauer | 2016-06-07 |
| 9323144 | Method for microcontact printing | Gerald Kreindl, Mustapha Chouiki | 2016-04-26 |
| 9312161 | Accommodating device for retaining wafers | Thomas Wagenleitner, Alexander Filbert | 2016-04-12 |
| 9305813 | Pressure transmitting device for bonding chips onto a substrate | Alfred Sigl | 2016-04-05 |
| 9252042 | Method for permanent bonding of wafers | Thomas Plach, Kurt Hingerl, Christoph Flotgen | 2016-02-02 |
| 9245869 | Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements | Jurgen Burggraf, Harald Wiesbauer, Alfred Sigl | 2016-01-26 |