Issued Patents 2016
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9500541 | Method and device for determining the pressure distribution for bonding | Bernhard Rebhan, Markus Wimplinger | 2016-11-22 |
| 9457552 | Method for detaching a product substrate off a carrier substrate | Friedrich Paul Lindner | 2016-10-04 |
| 9449863 | Device for aligning and pre-fixing a wafer | Friedrich Paul Lindner, Stefan Pargfrieder, Daniel Burgstaller | 2016-09-20 |
| 9390956 | Method for the temporary connection of a product substrate to a carrier substrate | Gerald Mittendorfer | 2016-07-12 |
| 9381729 | Device for detaching a product substrate off a carrier substrate | Friedrich Paul Lindner | 2016-07-05 |
| 9381732 | Device for stripping a product substrate from a carrier substrate | Friedrich Paul Lindner | 2016-07-05 |
| 9362154 | Method for treatment of a temporarily bonded product wafer | Harald Wiesbauer, Markus Wimplinger | 2016-06-07 |
| 9296193 | Bendable carrier mount, device and method for releasing a carrier substrate | Daniel Burgstaller | 2016-03-29 |
| 9278433 | Receiving device for receiving semiconductor substrates | Herbert Tiefenböck, Stefan Pargfrieder, Daniel Burgstaller | 2016-03-08 |
| 9272501 | Device for detaching a product substrate off a carrier substrate | Friedrich Paul Lindner | 2016-03-01 |
| 9245869 | Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements | Markus Wimplinger, Harald Wiesbauer, Alfred Sigl | 2016-01-26 |