Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362154 | Method for treatment of a temporarily bonded product wafer | Jurgen Burggraf, Markus Wimplinger | 2016-06-07 |
| 9245869 | Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements | Jurgen Burggraf, Markus Wimplinger, Alfred Sigl | 2016-01-26 |