AS

Alfred Sigl

EG Ev Group E. Thallner Gmbh: 2 patents #4 of 17Top 25%
📍 Dietfurt an der Altmühl, DE: #1 of 1 inventorsTop 100%
Overall (2016): #161,204 of 481,213Top 35%
2
Patents 2016

Issued Patents 2016

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9305813 Pressure transmitting device for bonding chips onto a substrate Markus Wimplinger 2016-04-05
9245869 Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements Jurgen Burggraf, Markus Wimplinger, Harald Wiesbauer 2016-01-26