Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515057 | Semiconductor package and method of manufacturing the semiconductor package | Tae-Je Cho, Ji Hwang Kim | 2016-12-06 |
| 9245771 | Semiconductor packages having through electrodes and methods for fabricating the same | Hyunsoo Chung, In-Young Lee, Moon Gi Cho, Chajea Jo, Taeje Cho | 2016-01-26 |