KE

Keiichi Endoh

DC Dowa Electronics Materials Co.: 2 patents #5 of 44Top 15%
Overall (2016): #125,423 of 481,213Top 30%
2
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9486879 Bonding material and bonding body, and bonding method Satoru Kurita, Yu Saito, Yutaka Hisaeda, Toshihiko Ueyama 2016-11-08
9240256 Bonding material and bonding method using the same Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama 2016-01-19